u/Smooth-Month-277

1.0 SUBSTRATE

Parameter	Specification
Material	Schott Borofloat 33 borosilicate glass
Dimensions	25.00 mm × 25.00 mm × 6.000 mm ±0.025 mm
Flatness	<2 μm across full surface
Surface finish	<5 nm Ra, both faces
Edge chamfer	0.20 mm × 45°, no chips >50 μm
Quantity	3 identical substrates

2.0 GRID LAYOUT

Parameter	Specification
Grid type	4×4 Cartesian
Pitch	5.000 mm ±0.010 mm center-to-center
Origin (0,0)	Bottom-left corner of substrate
Grid offset X	5.000 mm from left edge
Grid offset Y	5.000 mm from bottom edge
Cavity positions (X,Y) mm	(0,0), (5,0), (10,0), (15,0) / (0,5), (5,5), (10,5), (15,5) / (0,10), (5,10), (10,10), (15,10) / (0,15), (5,15), (10,15), (15,15)

3.0 CAVITY ARCHETYPES

Parameter	TYPE S (△)	TYPE M (◼︎)	TYPE L (▲)
Symbol	△	◼︎	▲
Diameter	3.000 mm ±0.005 mm	2.000 mm ±0.005 mm	1.500 mm ±0.003 mm
Depth	5.000 mm ±0.010 mm	10.000 mm ±0.010 mm	20.000 mm ±0.010 mm
Aspect ratio	1.67:1	5:1	13.33:1
Volume	35.34 mm³	31.42 mm³	35.34 mm³
Time constant (τ)	0.50 s ±0.02 s	1.00 s ±0.03 s	2.30 s ±0.05 s
Wall angle	90° ±0.3°	90° ±0.3°	90° ±0.3°
Wall finish	<0.1 μm Ra	<0.1 μm Ra	<0.1 μm Ra
Bottom finish	<0.2 μm Ra	<0.2 μm Ra	<0.2 μm Ra
Corner radius	<50 μm	<50 μm	<50 μm

4.0 CAVITY ASSIGNMENTS, CORE FFT (SPATIAL FREQUENCY DECOMPOSITION)

X (mm)	Y (mm)	Type	τ (s)
0	15	L	2.30
5	15	M	1.00
10	15	S	0.50
15	15	S	0.50
0	10	M	1.00
5	10	L	2.30
10	10	M	1.00
15	10	S	0.50
0	5	S	0.50
5	5	M	1.00
10	5	L	2.30
15	5	M	1.00
0	0	S	0.50
5	0	S	0.50
10	0	M	1.00
15	0	L	2.30

Kernal type, Symmetric Hankel. Anti-diagonals constant. Sensitive to spatial frequencies. No directional preference..

5.0 CAVITY ASSIGNMENTS, CORE GX (X-AXIS GRADIENT)

X (mm)	Y (mm)	Type	τ (s)
0	15	S	0.50
5	15	S	0.50
10	15	M	1.00
15	15	L	2.30
0	10	S	0.50
5	10	S	0.50
10	10	M	1.00
15	10	L	2.30
0	5	S	0.50
5	5	M	1.00
10	5	L	2.30
15	5	L	2.30
0	0	S	0.50
5	0	M	1.00
10	0	L	2.30
15	0	L	2.30

Gradient principle, Left columns (X=0,5) fast S-dominant, Right columns (X=10,15) slow L-dominant. Center transition M. Left heating → early output peak. Right heating → late output peak. Skewness proportional to ∂T/∂x,

6.0 CAVITY ASSIGNMENTS, CORE GY (Y-AXIS GRADIENT)

X (mm)	Y (mm)	Type	τ (s)
0	15	L	2.30
5	15	L	2.30
10	15	M	1.00
15	15	S	0.50
0	10	L	2.30
5	10	L	2.30
10	10	M	1.00
15	10	S	0.50
0	5	L	2.30
5	5	M	1.00
10	5	S	0.50
15	5	S	0.50
0	0	M	1.00
5	0	M	1.00
10	0	S	0.50
15	0	S	0.50

Gradient principle, Top rows (Y=10,15) slow L-dominant. Bottom rows (Y=0,5) fast S-dominant. Middle transition M. Bottom heating → early output peak. Top heating → late output peak, Skewness proportional to ∂T/∂y..

7.0 UWA-1

Component	Specification
Base	Pharmaceutical-grade paraffin wax, Tm = 60.0°C ±0.1°C
Latent heat	185 J/g ±5 J/g
Dopant 1	Pristine MWCNTs, Ø10-30 nm, L:1-10 μm, unfunctionalized, >95% purity
Loading 1	2.00 wt% ±0.05 wt%
Dopant 2	n-Tetracontane (C₄₀H₈₂), >99% purity, Tm = 81.0°C ±0.5°C
Loading 2	0.50 wt% ±0.02 wt%
Thermal conductivity (solid)	0.45 W/m·K
Thermal conductivity (liquid)	0.38 W/m·K

7.1 Composite Preparation

Step	Action	Parameters
1	Melt paraffin	82°C ±2°C, argon atmosphere
2	Add MWCNTs	High-shear 10,000 RPM, 30 min, 80-85°C
3	Add tetracontane	5,000 RPM, 15 min, 80°C
4	Ultrasonic probe	20 kHz, 100 W, pulse 5s/2s, 60 min, 78-82°C
5	Degas	<1×10⁻² mbar, 80°C, 60 min, until bubble-free
6	Store	Sealed, argon-filled, 6-month shelf life

8.0 INFUSION PROTOCOL

Step	Action	Parameters
1	Clean substrates	IPA ultrasonic, 40°C, 15 min → DI water rinse → N₂ dry → vacuum oven 120°C, 2 hr
2	Preheat	Substrate to 75°C ±1°C on vacuum hotplate
3	Evacuate	<1×10⁻³ mbar, hold 2 hr at 75°C
4	Introduce UWA-1	Via heated manifold, 75°C, sufficient to cover all cavities + 2 mm
5	Backfill	Argon to 2.0 bar absolute
6	Pressure hold	30 min at 2.0 bar, 75°C
7	Directional solidification	Gradient 5°C/mm across substrate thickness. Cool 0.20°C/min ±0.02°C/min from 75°C to 25°C under 0.5 L/min argon flow
8	Inspect	X-ray micro-CT, voxel <5 μm. Zero voids >0.01 mm³ in any cavity. Reject and rework if voids detected.

9.0 THERMAL BUSES

Parameter	Specification
Material	CVD single-crystal diamond
Dimensions	25.00 mm × 25.00 mm × 0.100 mm ±0.005 mm
Thermal conductivity	>1800 W/m·K
Electrical resistivity	>10¹² Ω·cm
Surface finish	<1 nm Ra, both faces
Quantity per core	2 (top incident face, bottom observer face)

9.1 Bonding

Parameter	Specification
Adhesive	BNNT-filled epoxy, 5 wt% loading
Bond line thickness	<5 μm
Thermal resistance	<0.1°C/W
Cure	25°C, 24 hr, vacuum compression 0.5 MPa
Post-cure	60°C, 4 hr, no pressure

10.0 PYROELECTRIC OBSERVER

Parameter	Specification
Material	z-cut LiTaO₃, single crystal
Dimensions	25.00 mm × 25.00 mm × 0.100 mm ±0.005 mm
Pyroelectric coefficient	>2.0 × 10⁻⁴ C/m²·K
Relative permittivity	46 at 1 kHz
Surface finish	<1 nm Ra

10.1 Electrodes

Parameter	Specification
Adhesion layer	Cr, 5 nm ±1 nm
Conductor	Au, 100 nm ±10 nm
Bottom electrode	Full-area ground plane, Z- face
Top electrodes	16 individual, aligned to cavities
Electrode sizes	S: 3.2×3.2 mm, M: 2.2×2.2 mm, L: 1.7×1.7 mm
Alignment tolerance	±10 μm to cavity centerlines
Patterning	Photolithography, lift-off
Edge pads	16 signal + 2 ground, 0.5×0.5 mm, 0.8 mm pitch

10.2 Poling

Step	Parameters
Temperature	85°C ±1°C
Voltage	100 V DC (Z+ positive), field = 1 MV/m
Hold	30 min at 85°C
Cool	1°C/min to 25°C under field
Remove field	At 25°C
Verify	Pyroelectric coefficient >2.0 × 10⁻⁴ C/m²·K

11.0 ENCAPSULATION

Parameter	Specification
Lid	CVD diamond, 25×25×0.100 mm
Seal adhesive	BNNT-filled epoxy, <10 μm bond line
Internal atmosphere	argon, 6N purity, 1.10 bar absolute at 25°C
Getter	Barium flash, 5×5 mm, activated post-seal
Leak rate	<1×10⁻⁸ atm·cc/s helium

12.0 CALIBRATION/ TFP...

Step	Action	Parameters
1	Uniform step	25°C → 30°C in <0.1 s. Record 16 ch at 200 Hz for 10 s. Extract τ per cavity. Verify within ±15% of nominal. Extract sensitivity (mV/°C).
2	Gradient GX	Left 30°C / Right 25°C. Record skewness. Calibration point +0.33°C/mm. Reverse for −0.33°C/mm. Fit linear model: ∂T/∂x = a·skewness + b.
3	Gradient GY	Top 30°C / Bottom 25°C. Record skewness. Calibration point −0.33°C/mm. Reverse for +0.33°C/mm. Fit linear model: ∂T/∂y = a·skewness + b.
4	Frequency sweep FFT	0.1, 0.2, 0.5, 1.0, 2.0, 5.0 Hz sinusoidal modulation. Record 16×16 coupling matrix.

12.1 Personality Map

• Core serial number and calibration date
• τ per cavity (16 values)
• Sensitivity per cavity (16 values)
• GX skewness coefficients (a, b)
• GY skewness coefficients (a, b)
• FFT coupling matrix (16×16)
• Thermal offset calibration

13.0 SYSTEM INTEGRATION

Parameter	Specification
Configuration	3 cores (FFT, GX, GY) on common thermal stage
Stage	Copper, Peltier-controlled, 25.0°C ±0.01°C
Spacing	10 mm between cores
Optics (optional)	Ge lens, f/2, 50 mm FL, AR 8-14 μm, FOV 30°×30°
Flex circuit	Polyimide, 18 μm Cu traces, 20-pin ZIF, 100 mm length, shielded
Readout	16-ch charge amplifier, 0.1-100 Hz BW, 200 Hz sample rate, 16-bit ADC

13.1 Output Vector

Quantity	Source	Units
Spatial frequency spectrum	FFT Core (16 components)	Normalized amplitude
∂T/∂x	GX Core	°C/mm
∂T/∂y	GY Core	°C/mm
	∇T
θ (gradient direction)	atan2(GY,GX)	radians