u/hakim37

The article takes a neutral stance but there's some details that are fundamentally bullish. EMIB-T confirmed to have a 36 mu_m metal pitches and has clear visibility to 25 mu_m. This means intel have taken the interconnect density crown from TSMC which makes EMIB cheaper, denser, and supports larger packaging dimensions.

Intel also showcased EMIB-T with a 240mm^2 package which could support 67 reticles (this is like 10x larger than what TSMC can currently do).

And there was a presentation showing Intels glass substrate didn't have cracking issues which TSMC (through Corning) were showing. Also showed working TGV, waveguides and combined with EMIB.

It also links this recent paper detailing intel glass progress (paywalled but abstract available, if anyone has access pls DM me): https://ieeexplore.ieee.org/document/11561301

Also I found this x reaction: https://x.com/trendforce/status/2061448191380258850

TLDR; Intel is not just a viable packaging alternative to TSMC they have leapfrogged them

About 40% better than Turin Dense at rack level. Tbh that's not as large an increase as it could have been. Also Intel GNR is still a mark above Vera. I think DMR shouldn't be too far behind.