Image 1 — LytrixLabs - A modular audio ecosystem & smart amplifier
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LytrixLabs - A modular audio ecosystem & smart amplifier

Hi everyone,

I'm an audio hobbyist and a passionate electrical engineering student. I originally came up with this project as a way to sharpen my engineering skills, with the ultimate goal of potentially turning it into a business if the community finds value in it. I'd love to show you what I've been working on over the past couple of months, where the project stands today, and get your honest feedback and suggestions.

LytrixLabs is an idea for a modular, future-proof audio system. It combines high-resolution 32-bit/768kHz DACs, dedicated DSP, and high-performance integrated Class-D amplification. By designing a fully modular ecosystem, you can expand or change your setup over time without replacing the entire unit, allowing the system to adapt as new audio technologies or DAC chips are developed.

The plan is to house this in a chassis featuring solid wooden side panels, a brushed aluminum finish, a 7-inch IPS touchscreen for the UI, and a large satisfying volume knob.

Quick Overview of the Device

The internal processing engine is powerful and designed to handle up to ~24 audio channels at 32-bit/768kHz, which opens the door for spatial audio decoding through eARC. It also features a dedicated DSP for audio processing and potential room correction. On the input side, up to ~12 channels are available, making room for phono preamplifier/ADC modules, balanced XLR inputs, or traditional line-level sources.

If this works out, I plan to create an open-source, well-documented template for the audio modules. This will allow anyone with the technical know-how to design or modify their own modules to suit their exact system needs.

Preliminary Specifications

  • Passive Cooling: Entirely passively cooled; no fan noise in your listening room.
  • Power: Up to 300W of continuous power draw across the amplifier modules, with a 500W+ peak.
  • Connectivity: HDMI eARC input, SPDIF input & output, 1Gb Ethernet, and Bluetooth 5.3 & WiFi 6 support.
  • Modular Capacity: 6 rear module slots, supporting 4 audio channels in both directions per slot.
  • USB Ports: 1x USB-C for digital audio input, 1x USB-A for playback from storage drives, firmware updates, and calibration microphone input.
  • Control: Trigger outputs allow for powering external equipment on/off automatically. Combined with HDMI-CEC, you get a one-click system startup. A classic IR receiver is included for remote compatibility.
  • Smart Monitoring: Real-time power and temperature sensing on every module. It can automatically apply gradual adjustments to output gain to match your specific setup, ensuring maximum safe output without hard voltage drops or overheating.

Planned Modules (Would love your suggestions!)

All modules integrate dedicated DACs and ADCs supporting up to 32-bit/768kHz audio. They utilize COG and film capacitors in the audio path, along with low-distortion op-amps and high-performance integrated Class-D chips.

Outputs:

  • 1x 200W amplifier module
  • 2x 100W amplifier module
  • 4x 50W amplifier module
  • 4x Line-level RCA outputs
  • 4x Balanced XLR outputs
  • 3.5mm & 6.3mm headphone outputs with high-impedance support

Inputs & Others:

  • 1x RCA & 1x Phono inputs
  • 2x Balanced XLR / 6.3mm combo inputs
  • 5:1 HDMI 2.1 switch module

What I've Achieved So Far

For the physical connection, I'm using a standard PCIe form factor interface for the modules. It's affordable, widely available, and ensures a solid mechanical hold. The current test carrier board simply breaks out the audio signals and provides power rails to the module to verify the basic architecture.

The Module Breakdown (Component Selection & Layout)

The layout focuses purely on solid electrical engineering principles to ensure good signal integrity:

  1. Isolation: The DAC chip (AKM AK4493) is placed at the top left, furthest away from potential high-frequency switching noise or crosstalk. Low-noise linear regulators (LDOs) provide clean power rails to the DAC.
  2. Buffering: An op-amp stage (OPA1642) acts as a buffer to prevent loading down the DAC, paired with linear COG capacitors.
  3. Amplification: The Class-D amplification is handled by the TI TPA3255 IC, which is one of the best integrated Class-D chips on the market right now. It is situated on the right side near the physical speaker outputs, right next to its output filtering stage.
  4. Telemetry: A dedicated power sensor monitors real-time power consumption for safety and system matching.

Of course, hardware prototyping rarely goes perfectly on the first try. I made a couple of minor routing mistakes on this first revision, but with a few minor bodge wires, I managed to get the core features up and running. Most importantly, it gave me a clean list of corrections for the next board revision.

Eventually, I got the core software written and successfully output a clean sine wave over USB.

I don't own specialized audio analyzer equipment to post definitive THD+N or SNR graphs. I also don't own high-end speakers to fully evaluate it, and I haven't done extensive listening tests yet anyway, as I moved on to designing the motherboard right after this milestone. From the brief testing I did do, the noise floor was completely silent and the sound was clean, but I can't claim anything definitive without real measurements.

The Motivation Behind It All

This entire project stemmed from my own frustration when trying to set up a digital crossover for my electrostatic speakers, which provide separate audio inputs for the low frequencies and high frequencies. I wanted a single integrated amplifier to handle the DSP, routing, and amplification under one roof rather than a messy "cable-spaghetti" pile of separate DACs, standalone DSP units, and multiple external amps.

There is still a ton of work to do, and progress can be slow since I'm studying full-time and working on the side, but it’s an incredible learning experience.

I would absolutely love to hear what modules you think are missing, your thoughts on the modular concept, or any features you'd want to see in a device like this. If you’re a fellow engineer, check out my other posts for a couple more details. I'll also do my best to answer any questions you may have in the comments! (:

u/LytrixLabs — 5 days ago

LytrixLabs - A modular audio ecosystem & smart amplifier

Hi everyone,

I'm an audio hobbyist and a passionate electrical engineering student. I came up with this project as a way to sharpen my skills, with the ultimate goal of potentially turning it into a business if everything works out. I'd love to show you guys what I've been working on over the past couple of months, where the project stands today, and what I'm aiming to achieve next.

LytrixLabs is my take on a modular, future-proof audio system. It combines top-of-the-line audio signal processing with high-resolution 32-bit/768kHz DACs and the best integrated Class-D amplifiers on the market. By designing a fully modular ecosystem, expanding your setup is easy, and the system can seamlessly adapt as better ICs are developed.

All of this will be housed in what I hope becomes a beautiful chassis featuring solid wooden side panels and a brushed aluminum finish. A 7-inch IPS touchscreen keeps the UI intuitive and adaptable, and of course, a nice, large, satisfying volume knob is a must.

Quick Overview of the Device

https://preview.redd.it/eofcdxsz0lah1.png?width=1060&format=png&auto=webp&s=84150ca2fa53d462c10ea5924f213bcab2d56622

The internal CPU is powerful, potentially allowing for spatial audio decoding through eARC and outputting up to ~24 audio channels at 32-bit/768kHz. It also features a dedicated DSP for extensive audio processing and room correction. On the input side, up to ~12 channels are available, making room for phono preamplifier/ADC modules, balanced XLR inputs, or even microphones and instruments.

And the best part? If this works out, I plan to create an open-source, well-documented template for the audio modules. This will allow anyone to adapt their amplifier setup to their specific needs (at their own risk, of course!).

Preliminary Specifications:

  • Passive Cooling: Entirely passively cooled, no fan noise.
  • Power: Up to 300W of continuous power draw spread across the amplifier, with a 500W+ peak.
  • Connectivity: HDMI eARC input, SPDIF input & output, 1Gb ethernet, and Bluetooth 5.3 & WiFi 6 support via an M.2 E-key slot.
  • Modular Capacity: 6 module slots, supporting 4 audio channels in both directions.
  • USB Ports: 2x USB connections (1x USB-C for digital audio input, 1x USB-A for playback from storage drives, offline firmware updates, and calibration microphone functionality).
  • Control: Trigger outputs allow for powering external equipment on/off, enabling a one-click bootup when combined with HDMI-CEC. A classic IR receiver is also included, making it compatible with any remote.
  • Smart Monitoring: Power and temperature sensing on every module allows for real-time system monitoring. Gradual, automatic adjustments to output gain can be applied to match your specific setup, ensuring you get maximum output power without hard voltage drops or overheating.

Planned Modules (Would love your suggestions!):

All modules integrate DACs and ADCs supporting up to 32-bit/768kHz audio. They utilize COG and film capacitors in the audio path, along with top-notch op-amps and the best currently available integrated Class-D solutions.

Outputs:

  • 1x 200W amplifier
  • 2x 100W amplifier
  • 4x 50W amplifier
  • 4x RCA outputs
  • 4x Balanced XLR outputs
  • 3.5mm & 6.3mm headphone outputs with high-impedance support

Inputs & Others:

  • 1x RCA & 1x Phono inputs
  • 2x XLR / 2x 6.3mm inputs (combined ports)
  • 5:1 HDMI 2.1 switch

What I've Achieved So Far

The first prototype module (right) and test carrier board (left), freshly soldered.

As you can see, I am using a PCIe x4 connector for the modules because it is standard, affordable, and widely available. However, I’ve already realized I will need more pins for the next revision, so I will likely switch to PCIe x8. The current carrier board simply breaks out the audio and communication signals while providing the necessary power rails to the module.

The module, plugged into the test carrier.

The Module Breakdown (Preliminary Component Selection):

  1. Power & Data: Power, audio, and communication signals enter through the PCIe connector.
  2. Control: A microcontroller (STM32F030) communicates with the main carrier board and manages all on-board peripherals (bottom left).
  3. DAC: The audio DAC (AK4493) is placed at the top left, furthest away from sources that might cause EMI or crosstalk. Extremely low-noise LDOs provide the clean power rails required for the 32-bit DAC to perform.
  4. Buffering: An op-amp gain/buffering stage (OPA1642) prevents loading the DAC. We use these audio-specialized op-amps alongside linear COG capacitors to preserve signal integrity.
  5. Amplification: Finally, the Class-D amplifier IC (TPA3255), along with its heatsink and output stage filtering, is located on the right side of the module near the physical outputs.
  6. UI/Debug: An indicator RGB-LED on the back allows for per-module statistics or debugging.
  7. Telemetry: A power sensor at the bottom monitors power consumption for each individual module.

Here is the full test setup using a 3D-printed fixture for stability, with the USB audio source on the bottom left and the programming interface clamped above it.

Of course, PCB designs rarely go perfectly to plan. I made a few mistakes with the communication routing and ran into some programming inconsistencies. However, with a cut trace and a few bodge wires, I managed to get the core features up and running. Most importantly, I took note of the mistakes so they can be easily fixed in the next revision.

First successful clean output!

Eventually, I was able to write the firmware, configure the hardware, and successfully output sound over USB! Sadly, I don't own the specialized equipment needed for precise audio measurements (like THD+N or SNR), but I've done some listening tests and it sounds great so far.

Next Steps: The Motherboard

With the individual modules working, I’ve started designing the main motherboard/carrier board. This is the backbone that the modules plug into, housing the primary processor and all main I/O.

https://preview.redd.it/2grca0jz0lah1.png?width=1187&format=png&auto=webp&s=85b9e38d01d11fe1616719cdb52951c9b0f1e220

I won't share too many details just yet, but it is by far the most complex board I've ever designed. So far, I have the CPU and its LPDDR4 memory placed and routed. Right now, I'm still working up the rest of the schematics and attempting to simulate the LPDDR4 memory layout.

The Motivation Behind It All

This entire project stemmed from my own search for an amplifier that would let me easily set up a digital crossover for my electrostatic speakers, which require separate audio inputs for the lows and highs. I wanted a single, integrated amplifier to handle this, rather than a cluttered "cable-spaghetti" mess of separate audio sources, DSP modules, and amplifiers.

My apologies to the non-engineers for all the technical jargon, but I hope some of you find the breakdown interesting! There is still a ton of work to do, and progress can be slow since I study full-time and work on the side.

Stay tuned for updates, and I'll do my best to answer any questions you have in the comments! (:

reddit.com
u/LytrixLabs — 5 days ago

[Project] LytrixLabs - A modular audio ecosystem & smart amplifier

Hi everyone,

I'm an audio hobbyist and a passionate electrical engineering student. I came up with this project as a way to sharpen my skills, with the ultimate goal of potentially turning it into a business if everything works out. I'd love to show you guys what I've been working on over the past couple of months, where the project stands today, and what I'm aiming to achieve next.

LytrixLabs is my take on a modular, future-proof audio system. It combines top-of-the-line audio signal processing with high-resolution 32-bit/768kHz DACs and the best integrated Class-D amplifiers on the market. By designing a fully modular ecosystem, expanding your setup is easy, and the system can seamlessly adapt as better ICs are developed.

All of this will be housed in what I hope becomes a beautiful chassis featuring solid wooden side panels and a brushed aluminum finish. A 7-inch IPS touchscreen keeps the UI intuitive and adaptable, and of course, a nice, large, satisfying volume knob is a must.

Quick Overview of the Device

Preliminary device overview

The internal CPU is powerful, potentially allowing for spatial audio decoding through eARC and outputting up to ~24 audio channels at 32-bit/768kHz. It also features a dedicated DSP for extensive audio processing and room correction. On the input side, up to ~12 channels are available, making room for phono preamplifier/ADC modules, balanced XLR inputs, or even microphones and instruments.

And the best part? If this works out, I plan to create an open-source, well-documented template for the audio modules. This will allow anyone to adapt their amplifier setup to their specific needs (at their own risk, of course!).

Preliminary Specifications:

  • Passive Cooling: Entirely passively cooled, no fan noise.
  • Power: Up to 300W of continuous power draw spread across the amplifier, with a 500W+ peak.
  • Connectivity: HDMI eARC input, SPDIF input & output, 1Gb ethernet, and Bluetooth 5.3 & WiFi 6 support via an M.2 E-key slot.
  • Modular Capacity: 6 module slots, supporting 4 audio channels in both directions.
  • USB Ports: 2x USB connections (1x USB-C for digital audio input, 1x USB-A for playback from storage drives, offline firmware updates, and calibration microphone functionality).
  • Control: Trigger outputs allow for powering external equipment on/off, enabling a one-click bootup when combined with HDMI-CEC. A classic IR receiver is also included, making it compatible with any remote.
  • Smart Monitoring: Power and temperature sensing on every module allows for real-time system monitoring. Gradual, automatic adjustments to output gain can be applied to match your specific setup, ensuring you get maximum output power without hard voltage drops or overheating.

Planned Modules (Would love your suggestions!):

All modules integrate DACs and ADCs supporting up to 32-bit/768kHz audio. They utilize COG and film capacitors in the audio path, along with top-notch op-amps and the best currently available integrated Class-D solutions.

Outputs:

  • 1x 200W amplifier
  • 2x 100W amplifier
  • 4x 50W amplifier
  • 4x RCA outputs
  • 4x Balanced XLR outputs
  • 3.5mm & 6.3mm headphone outputs with high-impedance support

Inputs & Others:

  • 1x RCA & 1x Phono inputs
  • 2x XLR / 2x 6.3mm inputs (combined ports)
  • 5:1 HDMI 2.1 switch

What I've Achieved So Far

The first prototype module (right) and test carrier board (left), freshly soldered.

As you can see, I am using a PCIe x4 connector for the modules because it is standard, affordable, and widely available. However, I’ve already realized I will need more pins for the next revision, so I will likely switch to PCIe x8. The current carrier board simply breaks out the audio and communication signals while providing the necessary power rails to the module.

The module, plugged into the test carrier.

The Module Breakdown (Preliminary Component Selection):

  1. Power & Data: Power, audio, and communication signals enter through the PCIe connector.
  2. Control: A microcontroller (STM32F030) communicates with the main carrier board and manages all on-board peripherals (bottom left).
  3. DAC: The audio DAC (AK4493) is placed at the top left, furthest away from sources that might cause EMI or crosstalk. Extremely low-noise LDOs provide the clean power rails required for the 32-bit DAC to perform.
  4. Buffering: An op-amp gain/buffering stage (OPA1642) prevents loading the DAC. We use these audio-specialized op-amps alongside linear COG capacitors to preserve signal integrity.
  5. Amplification: Finally, the Class-D amplifier IC (TPA3255), along with its heatsink and output stage filtering, is located on the right side of the module near the physical outputs.
  6. UI/Debug: An indicator RGB-LED on the back allows for per-module statistics or debugging.
  7. Telemetry: A power sensor at the bottom monitors power consumption for each individual module.

Here is the full test setup using a 3D-printed fixture for stability, with the USB audio source on the bottom left and the programming interface clamped above it.

Of course, PCB designs rarely go perfectly to plan. I made a few mistakes with the communication routing and ran into some programming inconsistencies. However, with a cut trace and a few bodge wires, I managed to get the core features up and running. Most importantly, I took note of the mistakes so they can be easily fixed in the next revision.

First succesful clean output!

Eventually, I was able to write the firmware, configure the hardware, and successfully output sound over USB! Sadly, I don't own the specialized equipment needed for precise audio measurements (like THD+N or SNR), but I've done some listening tests and it sounds great so far.

Next Steps: The Motherboard

With the individual modules working, I’ve started designing the main motherboard/carrier board. This is the backbone that the modules plug into, housing the primary processor and all main I/O.

https://preview.redd.it/240jyvrnhhah1.png?width=1187&format=png&auto=webp&s=461a0cfa327d3e3aa5b9b148c033d147eec205ea

I won't share too many details just yet, but it is by far the most complex board I've ever designed. So far, I have the CPU and its LPDDR4 memory placed and routed. Right now, I'm still working up the rest of the schematics and attempting to simulate the LPDDR4 memory layout.

The Motivation Behind It All

This entire project stemmed from my own search for an amplifier that would let me easily set up a digital crossover for my electrostatic speakers, which require separate audio inputs for the lows and highs. I wanted a single, integrated amplifier to handle this, rather than a cluttered "cable-spaghetti" mess of separate audio sources, DSP modules, and amplifiers.

My apologies to the non-engineers for all the technical jargon, but I hope some of you find the breakdown interesting! There is still a ton of work to do, and progress can be slow since I study full-time and work on the side.

Stay tuned for updates, and I'll do my best to answer any questions you have in the comments! (:

reddit.com
u/LytrixLabs — 5 days ago