u/Spiritual-Process-96

I recently finished processing 1,500 grams of gold-plated telecom pins and used the cupric chloride (acid peroxide) process to dissolve the base metals before recovering the gold foils. It took forever to dissolve the pins…

I know there are several ways to tackle this, including nitric acid and reverse electroplating, and I'm curious what experienced refiners here prefer. If you've used more than one method, what are the biggest advantages and disadvantages you've found?

I documented the entire experiment in a 5 minute video in case anyone is interested in seeing my process from start to finish.

https://youtu.be/Z02j6FTaGIg

I’ve been trying to put more real numbers behind e-waste gold recovery instead of vague estimates.

This time I tested older telecom boards and found a surprisingly large yield difference between the edge fingers and the rest of the board plating.

I documented the stripping process and the actual gold foil yield in this short video.

https://youtu.be/RLCbLNfOUcQ

Interested to hear what kind of yields others have seen from telecom equipment.

Been refining my process for separating gold foils from gold fingers and finally getting cleaner, more consistent results.

This run had:

• Better foil separation
• Less material loss
• Cleaner boards after processing
• Improved agitation and timing

Still learning and improving each batch, but this is probably my cleanest result so far. Curious what you’d optimize next or what methods have worked best for you.

https://youtu.be/Pu5SJ6zN_wM