u/Tricky_Cranberry9568

Hello, It is my first time doing PCB design for my project, I am currently designing a boost converter using the TPS61023DRLR IC and want some feedback for it before I order it from JLCPCB.

Essentially I have just created three pours on the F.CU layer for VOUT, VIN and GND as seen in the layout example and then used via stitching on the gnd pours to connect it to the B.CU layer which is all GND (Blue). This is my first time working with pours so I'm not really confident if this is how it should look like so I would like a check if possible before I order the pcb.

The MCU is really small so the copper pours didn't allow me to like fill into the individual pads which is why I solved it by just making traces to the pad to the pour, I don't know if I should do this though (Image 3)

Here are relevant links:

Datasheet for IC

Hello, It is my first time doing PCB design for my project, I am currently designing a boost converter using the TPS61023DRLR IC and want some feedback for it before I order it from JLCPCB. I had some trouble with Front solder mask errors on the pins of the IC, so what i did was set the solder mask expansion of relevant pins to 0mm. However I'm not confident if this will cause issues with the manufacturer. I have attached JLCPCB's specifications on solder mask expansion but I don't really understand it. Any help would be appreciated thankyou!!

https://www.ti.com/lit/ds/symlink/tps61023.pdf