




3.5L 3D-printed case, riser-less 4060, AMD 7600, HDPLEX GaN 250W
I built this a couple years ago when the 4060 LP first came out. I had a mini-ITX motherboard leftover from upgrading my machine to an ATX motherboard (seen here) so I added an HDPLEX psu and tried to make the smallest possible case for a riser-less computer. The case is made specifically for this 4060 LP and there is about 1mm of space between the components and the case, which measures at 212mm x 192mm x 86mm with a wall thickness of 3mm.
I specifically wanted the simplest case to 3D print and build into so it's just basically a box and it fits on my 3D printer (Prusa MK3S) and prints in two pieces: the box and the panel cover. The design was something where I thought thermals-be-damned, I just wanted to see if the parts could fit together and give a dense brick of computing. So I basically jammed the PSU in front of the fan cooling the CPU.
Surprisingly, this works ok for gaming and gaming benchmarks. IIRC the Cyberpunk benchmark measured temps in the mid 80s F, which is hot but still doable. Where it falls down hard is in Cinebench where we would hit the thermal throttling limit pretty fast. Anyway, I wouldn't recommend this design, it's just an experiment that worked out ok. I used it as a second computer but it's been neglected for a while. I've ordered a Thorzone Tetra S and am hoping to move the motherboard and a 4090 into that if it comes soon. If not, it'll be time to rebuild the FormD T1.
Of the pictures included here, there are two versions of the case: one has hexagon cut outs on the top and bottom, that is v1, and the update has slot cut outs to allow screwing in fans, that is v1.1. The second version has another screw hole to tighten up the left panel so it feels like a solid brick. I didn't extend the case to allow fitting in bigger fans which would've helped thermals. Instead the case just barely fits the motherboard and we use 40mm Noctua fans at the top, overlapping the motherboard.