r/TSMC

Hi, I got the offer letter for an EE role last week. I start on August 31. I didn't get any communication about the next steps whatsoever. I tried reaching out to the recruiter, no response. I need to relocate to AZ ASAP, but have no idea about anything. What can I do? Who else can I reach out to? Any help would be appreciated. Thanks.

Title: How one engineer single-handedly altered the TSMC, Samsung, and SMIC 7nm timeline

Most semiconductor news focuses on trade bans, state subsidies, and multi-billion-dollar fabs. But the trajectory of the modern chip race was heavily shaped by a single individual: Liang Mong-song (梁孟松).

Here is a quick breakdown of how one R&D leader impacted three global chip giants over two decades:

• TSMC Era: As one of the core R&D directors, Liang helped steer TSMC toward copper lithography over IBM's approach, laying the foundation for TSMC's manufacturing dominance. After being bypassed for a promotion in 2009, he left the company.
• The Samsung Leap: Moving to South Korea, Liang spearheaded Samsung's shift straight to 14nm FinFET, allowing Samsung to temporarily beat TSMC to market and capture major orders for Apple and Qualcomm. This resulted in a landmark trade-secrets lawsuit in Taiwan.
• SMIC & The 7nm DUV Workaround: Joining SMIC in 2017, Liang rapidly raised 14nm yield rates. When US export controls blocked access to ASML's EUV machinery, Liang leveraged multi-patterning techniques on existing Deep Ultraviolet (DUV) equipment to achieve commercial 7nm production.

I put together a deep-dive visual documentary covering his career, the FinFET physics transition, and how SMIC pushed past EUV limitations:

Watch here:https://youtu.be/jHE3OetNf2U

Would love to hear your thoughts on how viable DUV multi-patterning remains for SMIC moving forward, or if the yield costs make it unsustainable long-term.

I’m about 6 days out from my second interview for equipment tech. I’m wondering if anyone can share their experience on a timeline for rejections or offers to see what I’m looking at.

Thanks for any engagement!

If you are joining in upcoming days, let’s get connect and talk. Housing and other matters.

I still have one question to ask, what to expect in Pre-boarding procedure, what information or document they ask. Thank you.

What’s the promotion ladder like for Americans here? And has any American went from an engineer to a management position here? Is it possible or not heard of? And if so is there any advice you could give?

Hello all,

I just want to know how soon I would be expected to know the result for the interview.

I think I did pretty well in the interview. And the manager did ask me for the join date( I count it as a positive sign)

Thanks for any information

“We will initiate pre-onboarding process for you and there will be pre-employment tasks that you will need to complete. HR will be requesting additional information prior to your start date. Please be sure to check your email’s spam folder if you don’t see these emails.”

This is a message I received. What can I expect to do?
Any help will be appreciated

Just recieved an offer on monday for equipment engineer at fab21 in Arizona. My offer link expired just after 2 days from recieving it. Anyone ever had that happen to them? I’m genuinely tweaking, I don’t understand why they would rescind it or something out of nowhere after 2 days

Hello everybody, I have three question to ask and looking for your opinion.

1. How long it usually take to get the feedback, can be more round or a decision will come after this ?

2. After interview, manager asked-earliest time of joining, for me that's December, will this late can affect of the decision.

3. Whole interview went well, except one question lastly asked about past mistake, which I could have delivered better way however I deliver the answer, can that have any impact?
   Thank you.

Hi , I am joining TSMC on September 14th and Love to connect with people who are joining as well !

Hi everyone,

I have a first-round interview with TSMC for an Product Engineer- yield and Quality (PES) role. I also received a behavioral assessment that must be completed at least 24 hours before the interview.

The interview panel consists of 4 engineers and manager.

For those who've interviewed at TSMC, what should I expect from both the behavioral assessment and the interview? Is it mainly technical, behavioral, or a mix? What topics should I focus on while preparing?

Any tips or advice would be greatly appreciated. Thanks!

Hi, I’m joining TSMC next month as a Process Integration Engineer and looking for potential flatmates and suitable housing. Any leads would be helpful.

So I had my first interview with TSMC for module process engineer role and it was scheduled for 1 hour but the interview lasted only for 30 mins. Is it normal? Like I felt the interview went pretty good and I also got chance to ask all my questions to them.

Hello Everybody,

I have passed first round of interview in Process Integration Engineer position, and invited for the second round.
In my first round, a manager and an engineer present. Manager asked me some technical questions related to device physics, lithography and engineer asked me related to conflict in teamwork.
What to expect in second round? Interview panel this time three manager and one engineer.

Thank you.

Hi everyone,

I have a first-round interview with TSMC for an Industrial Manufacturing Engineer (IME) role. I also received a behavioral assessment that must be completed at least 24 hours before the interview.

The interview panel consists of 2 engineers and 1 manager.

For those who've interviewed at TSMC, what should I expect from both the behavioral assessment and the interview? Is it mainly technical, behavioral, or a mix? What topics should I focus on while preparing?

Any tips or advice would be greatly appreciated. Thanks!