August 18, 2026

LONDON & NEW YORK--(BUSINESS WIRE)-- Vertical Aerospace Ltd. (“Vertical” or the “Company”) (NYSE: EVTL), a global aerospace and technology company pioneering electric aviation, today announces it will hold its Annual General Meeting (“AGM”) at 1:00 pm BST on September 11, 2026 at their Bristol Headquarters, Unit 1, Camwal Court, Chapel St, Bristol BS2 0UW, United Kingdom.

Shareholders are invited to consider proposals detailed in the Company’s circular to shareholders, providing notice of the AGM to the Company’s shareholders, and including a letter to the Company’s shareholders and a form of proxy card in connection with the proposals sought to be adopted by the AGM, which is attached as an exhibit to a current report on Form 6-K, filed with the U.S. Securities and Exchange Commission on August 18, 2026.

Read the full announcement…

https://investor.vertical-aerospace.com/news/news-details/2026/Vertical-Aerospace-Announces-Date-for-AGM/default.aspx

And here is the corresponding Form 6-K…

https://d18rn0p25nwr6d.cloudfront.net/CIK-0001867102/60522022-d752-42ba-a3da-16f3d95a988b.pdf

‘The debate surrounding Europe’s semiconductor strategy has largely been framed around manufacturing. Governments have committed tens of billions of euros to attract new fabs, strengthen supply chains, and reduce dependence on overseas production. These investments are important and long overdue.

However, if Europe’s ambition is to become a global semiconductor leader, manufacturing alone will not be enough. The most successful semiconductor companies in the world don’t necessarily own the largest fabs. They own customer relationships, system expertise, intellectual property, product roadmaps, and long-term supply chains. Europe’s next challenge is not simply to build more fabs. It is to build more semiconductor champions.’

Ian Lankshear, EnSilica CEO, 6th August 2026

Read the full article…

https://www.eetimes.com/beyond-the-fab-building-europe-next-generation-of-semiconductor-champions/

11 August 2026

Invinity Energy Systems plc

("Invinity" or the "Company")

 

Progress on FlexBase Project Delivery

Invinity selects Equans Switzerland as EPC partner

 

Further to the announcement on 21 May 2026 that the Company had been selected to design the world's largest vanadium flow battery ("VFB") for FlexBase Group's Technology Centre Laufenburg ("TZL") project in Switzerland, Invinity Energy Systems plc (AIM: IES), a global leader in vanadium flow battery technology, is pleased to announce that it has signed an Engineering, Procurement and Construction (EPC) agreement with Equans Switzerland ("Equans"), for the preparation of delivery of the project.

Under the agreement, Equans will be responsible for providing the mechanical, electrical and piping works as well as other ancillary technical services to Invinity's VFB battery solution as part of the wider TZL project located in Laufenburg, Switzerland. The project will feature an AI datacentre and technology campus integrated with a 1.5 GWh Invinity VFB system, believed to be the world's largest. The VFB is expected to expand to 2.1 GWh in a subsequent development phase.

This partnership builds on an established working relationship between the two companies, including collaboration on a vanadium flow battery project in Belgium announced in 2022. This experience provided both companies with direct insight into each other's technical capabilities and delivery standards, reinforcing Equans' confidence in the high-quality, reliability and suitability of Invinity's technology for deployment into the TZL project.

Further to previous announcements, engineering and detailed design phase activities are already well advanced and are proceeding as planned. Key construction milestones have been achieved on schedule and both companies are continuing to work collaboratively alongside FlexBase and other project stakeholders to advance the project toward full delivery.

Claudio Picech, Chief Executive Officer at Equans Switzerland said: 

*"*We are proud to partner with Invinity for this landmark project, a market leader in high quality, flexible, high-throughput BESS (Battery Energy Storage Systems), with whom Equans also works in other countries. The award recognizes our expertise in delivering complex energy and infrastructure projects and reinforces our commitment to supporting Switzerland's energy transition through innovative and sustainable technologies. Together with Invinity and FlexBase, we are helping to establish a new benchmark for large-scale energy storage." 

Jonathan Marren, Chief Executive Officer at Invinity said:

*"*The successful deployment of a project of this scale requires a delivery partner with exceptional technical capabilities, a strong safety culture and deep local expertise. Equans Switzerland demonstrated all of these qualities throughout our demanding evaluation process and has proven to be the ideal partner to support the delivery of this landmark project."

Read the full RNS announcement…

https://www.londonstockexchange.com/news-article/IES/progress-on-flexbase-project-delivery/17731734

The New York-listed company is closing in on a further fundraising weeks after announcing advanced talks with the government about a grant worth up to £10m, Sky News learns.

The $100m equity infusion will include $35m from existing institutional backers as well as potential new investors, with the bulk of the commitment coming from Mudrick Capital Management and Yorkville Advisors, two big current shareholders in Vertical Aerospace.

Mark Kleinman, Sky News, 9th August 2026

Read the full article…

https://news.sky.com/story/flying-taxi-maker-vertical-aerospace-to-land-fresh-100m-capital-injection-13571326

While the ‘Major SpaceTech’ contracts announced by EnSilica in April* did not confirm which ‘leading European satellite operator’ EnSilica had secured business with, it’s interesting to note the rise this morning in EnSilica’s share price coinciding with this announcement from SES who will be leading on user terminal development amongst other aspects…

https://www.reddit.com/r/SES_Satellites/comments/1vhwz1x/ses_advances_nextgeneration_meo_strategy/

* https://www.londonstockexchange.com/news-article/ENSI/major-spacetech-contracts/17559666

3 August 2026

Invinity Energy Systems plc

("Invinity" or the "Company")

 

43 MWh Sale to U.S. Power Cooperative

Invinity technology to be deployed by Dairyland Power Cooperative across multiple sites in U.S. Midwest

Invinity Energy Systems plc (AIM: IES), a global leader in vanadium flow battery technology, is pleased to announce the sale of 43 MWh of battery systems to Dairyland Power Cooperative ("Dairyland") for deployment across long duration energy storage ("LDES") projects in the U.S. Midwest.

The project forms part of the Rural Energy Viability for Integrated Vital Energy ("REVIVE") programme which is being supported by funding from the U.S. Department of Energy which the Company previously announced in September 2023. Dairyland Power Cooperative supplies wholesale electricity to member-owned utilities serving communities across Wisconsin, Minnesota, Iowa and Illinois.

Invinity's vanadium flow batteries will be used to support grid resilience and reliability across multiple locations in Dairyland's Upper Midwest service territory, with delivery phase expected to commence in late 2027. The Company's Endurium technology was selected by Dairyland based on its ability to perform long duration charge/discharge cycles to support the network as demand and supply fluctuates. Invinity's strong track record of delivery in the U.S. market and strong field performance of existing assets was also an important consideration in the selection process.

Headquartered in Wisconsin, Dairyland plays a critical role in maintaining reliable power supplies across a large rural service territory and has been selected by U.S. Department of Energy to lead the REVIVE programme, a multi-site long-duration energy storage initiative intended to strengthen grid resilience and support the integration of vital energy resources across rural Midwestern communities. Further information on the projects will be released by Dairyland following an announcement event later this summer.

This deal represents Invinity's largest sale to date and builds upon recent U.S. commercial traction achieved by the Company including the 32 MWh sale to Pacific Steel Group in California and a 2 MWh sale to a C&I site in Wisconsin.

Matt Harper, President at Invinity said:

"This is a major win for Invinity and another clear sign that demand for proven, flexible, durable storage solutions is accelerating in the United States. Dairyland's projects are exactly the kind of demanding, real-world applications Endurium was built for: deep cycling, long life and dependable performance across multiple sites. For rural cooperatives, where reliability and affordability are critically important, our technology can help strengthen the grid, manage peaks and improve power quality without passing unnecessary cost on to consumers. With three U.S. project wins in quick succession, we at Invinity are excited to be building real momentum and creating a stronger order book for our U.S.-based manufacturing capacity."

Stay up to date with news from Invinity. Join the distribution list for the Company's monthly investor newsletter here.

About Dairyland Power Cooperative: Founded in 1941, Dairyland provides the wholesale electrical requirements and other services for 24 Class A member distribution cooperatives, 2 Class B members and 27 municipal utilities in the Upper Midwest. In turn, these cooperatives and municipals meet the energy needs of over 800,000 people. Dairyland delivers electricity over 3,700 miles of transmission lines and 400 distribution substations located throughout the system's 44,500 square mile service area.

Read the full RNS announcement…

https://www.londonstockexchange.com/news-article/IES/43-mwh-sale-to-u-s-power-cooperative/17717712

3 August 2026

 

EnSilica plc

("EnSilica", the "Company" or the "Group")

 

€1.7 Million Contract for Second Phase of Satellite Payload Communications ASIC Programme

and EnSilica Joins European 5G Satellite User Terminal Project

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Industrial, and Automotive markets, is pleased to announce that it has secured a second contract worth €1.7 million from a leading European satellite manufacturer. The contract follows the completion of an earlier funded feasibility contract for a new satellite payload communications ASIC programme, which was one of the three satellite payload feasibility studies announced by the Company on 3 November 2025.

This second contract represents the next phase of the original engagement, and is expected to be delivered over approximately 10 months. Building on the feasibility study, EnSilica will develop the system architecture, signal processing algorithms and systems demonstrator device required before the ASIC enters the full development phase.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

"We are delighted to have been selected again by this key European satellite manufacturer to continue this important programme. The contract further strengthens EnSilica's position as a leading European supplier of complex communications ASICs for the space and communications sector and reflects our growing expertise in satellite payload and advanced digital signal processing.

We are pleased to be trusted to continue, and we look forward to working closely with the customer as the programme progresses towards full ASIC development."

European 5G Satellite User Terminal Project

In addition, EnSilica is pleased to be partnering in the 5G-aNTeNna project, a European collaboration led by Silicon Austria Labs targeting the European Union's IRIS² satellite constellation, which serves government, defence and enterprise users.

The consortium of six European partners is developing a compact user terminal combining 5G non-terrestrial network connectivity (5G-NTN) with efficient phased array antennas intended to deliver resilient Ka-band broadband, with EnSilica providing the key satellite user terminal ASSPs (Application Specific Standard Products). The project places EnSilica in the ground segment of Europe's sovereign satellite infrastructure and gives it a platform to address the wider satcom market as it moves to 5G-NTN.

Read the full RNS announcement…

https://www.londonstockexchange.com/news-article/ENSI/second-phase-contract-win-new-project-update/17717635

27 July 2026

EnSilica plc

("EnSilica" or the "Company")

Result of General Meeting

Total Voting Rights

EnSilica (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Industrial, and Automotive markets, announces that at the general meeting of the Company held earlier today, all resolutions were duly passed. The results of the proxy voting will be available on the Company's website in due course. 

As a result of the resolutions being passed today, the Second Tranche Placing, the Subscription and the Retail Offer as announced on 7 July and 9 July 2026 can now proceed to completion. Therefore, it is expected that Admission of the new Ordinary Shares to trading on AIM will become effective at 8.00 a.m. on 29 July 2026.

Commenting on the successful fundraising, EnSilica's CEO Ian Lankshear said:

"We would like to thank shareholders and other investors for their participation in this fundraising. The fundraising contributes to a capital base which will allow EnSilica to respond to new opportunities arising in high growth industries such as satellite communications and photonics, thereby continuing the exciting growth trajectory that we are currently seeing across our business."  

Total Voting Rights

Upon Admission, the Company's issued share capital will consist of 134,235,414 Ordinary Shares with one voting right each. The Company does not hold any Ordinary Shares in treasury. Therefore, the total number of Ordinary Shares and voting rights in the Company will be 134,235,414. With effect from Admission, this figure may be used by shareholders in the Company as the denominator for the calculations by which they will determine if they are required to notify their interest in, or a change to their interest in, the share capital of the Company under the FCA's Disclosure Guidance and Transparency Rules.

Terms used but not defined in this announcement have the same meaning as set out in the Company's announcement released at 5.01 p.m. on 6 July 2026.

Read the full RNS announcement…

https://www.londonstockexchange.com/news-article/ENSI/result-of-general-meeting-and-total-voting-rights/17707304

EnSilica (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Industrial, and Automotive markets, is pleased to announce follow-on chip orders worth €1.1 million from a European satellite communications customer.  The orders are for EnSilica's ENS92040 distributed digital beamformer Application Specific Standard Product ('ASSP') for the satellite communications user terminal market.

History of the ENS92040 digital satellite beamformer ASSP:

·   In February 2023, EnSilica announced funding of €5 million from the European Space Agency ('ESA') to develop a new chip for satellite broadband user terminals, which is the ENS92040 digital satellite beamformer ASSP, and is now a key component of the Group's satellite communications user terminal chip set.

·   In August 2023, EnSilica announced a €2.5 million order from the European satellite communications customer for ENS92040, acquiring early, but not exclusive, access and an initial order for 50,000 of the ASSP.

·   Today, the same customer has committed a further €1.1 million for the ASSP, comprising €350,000 for additional samples and €750,000 to contribute towards product enhancements.

The ENS92040 is a highly integrated distributed digital beamformer chip that performs high-speed data conversion, digital signal processing and beamforming for electronically steerable flat-panel satellite communications user terminals. The device enables scalable, low-power user terminals for next-generation LEO, MEO and GEO satellite broadband constellations. It is also one of the ASSPs identified for further investment as part of the Company's recently announced equity fundraising. Supply revenue is expected to grow significantly from 2029, as this new generation of satellite constellations enter service. 

The satellite communications user terminal market has a Serviceable Addressable Market which is expected to grow by 5x, up from $650m in 2025 during initial deployment and growing to over $3bn alongside mass adoption in 2030. 

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

"These follow-on orders demonstrate continued commercial momentum for the ENS92040 and represent another important milestone as the device progresses towards production. The production phase is expected to align with new satellite constellations coming into service from 2029, when high-volume supply is anticipated.

The ENS92040 development programme validates our strategy of combining ESA-funded innovation with proprietary ASSPs that address the rapidly growing satellite communications market and reinforces our confidence in the long-term commercial opportunity for this exciting product family."

See the full RNS announcement…

https://www.londonstockexchange.com/news-article/ENSI/follow-on-satellite-orders/17699417

Bringing together aircraft manufacturers, regulators, air navigation service providers and infrastructure partners, the programme is Europe's equivalent of the FAA's eVTOL Integration Pilot Program (eIPP) in the U.S., helping develop the operational framework needed to enable commercial advanced air mobility at scale.

Simulations and demonstrations will form the centerpiece of the project, including flight demonstrations using Vertical Aerospace's eVTOL between Malaga and Marbella in Spain.

“Advancing electric aviation requires more than just an advanced aircraft. It requires an ecosystem of trusted partners working together to enable safe, seamless operations in an increasingly complex airspace,” said Michael Cervenka, chief commercial and strategy officer of Vertical Aerospace.
“Project VERTI-GO is Europe's equivalent of the FAA's eVTOL Integration Pilot Program in the U.S., bringing together industry, regulators and air navigation providers to develop that operational framework. This kind of collaboration is essential to building confidence in the technology and accelerating the industry's path forward.”

More information on the initiative is in the press release from Honeywell Aerospace here…

https://www.honeywellaerospace.com/us/en/company/newsroom/2026/07/verti-go-evtol-drone-integration

A positive leading article on Vertical Aerospace in The Times business section. It’s paywalled but here’s an excerpt…

‘Vertical’s chief executive, Stuart Simpson, said the government funding, plus promises of lending support from UK Export Finance, means the company will now begin scouting for an aircraft production site in Britain and a location for the construction of a battery-production gigafactory.

“We have been saying to the government that this is a phenomenal opportunity if we can anchor this business in the UK, creating up to an initial 1,000 jobs and supporting a further 2,000 to 3,000 in the supply chain,” said Simpson. “Now we can after this major vote of confidence from the UK government in Vertical.”

He continued: “This is our aerospace sector and the UK’s opportunity to lead the next generation of aviation. The UK has backed us from the earliest stages of the programme and with proposed support we can build aircraft that will be exported to customers around the world.”’

Robert Lea, The Times, 21st July 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

Proposed Placing and Subscription to raise up to £14 million

Proposed Retail Offer to raise up to £1 million

Fundraising to accelerate contracts and sales pipeline

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Industrial, and Automotive markets, announces its intention to conduct an equity fundraising to raise gross proceeds of up to £14 million by way of a placing and subscription, as well as a retail offer to raise up to £1 million (together, the "Fundraising"). 

Ian Lankshear, CEO of EnSilica, commenting on the Fundraising:

"EnSilica has never had a stronger pipeline of opportunities. Existing and new customers, particularly Space and Photonics businesses, need support to keep up with the growth in their sectors and are asking us to bid for valuable new projects. The Fundraising will enable EnSilica to compete strongly and deliver on new projects and thereby continue the exciting growth trajectory that we are currently seeing across our business."

Rationale for the Fundraising

In March 2026 the Company successfully raised £10 million through an equity fundraising. This enabled the Company to make material strategic progress and secure contracts with an expected aggregate lifetime value of up to US$175 million, all of which contributed to the Company achieving a record performance for the financial year ended 31 May 2026 ("FY2026"), as announced on 23 June 2026. The new contracts increased the Group's expected lifetime supply revenues to US$375 million and helped deliver 80 per cent. revenue coverage for the financial year ending 31 May 2027 ("FY2027"). 

In addition, the Group announced it had increased its sales opportunities pipeline by 50 per cent. to US$600 million. This uplift in opportunity is substantial and the board of directors of EnSilica (the "Board" or the "Directors") believes that undertaking the Fundraising will support the Group's ability to convert these opportunities to contracted revenues, while ensuring that there are sufficient skilled personnel to deliver on projects and thereby continue this acceleration in the Group's growth trajectory.

In particular, the Board recognises that there is a substantial market opportunity in the space sector with the global satellite communication ("SatCom") market due to grow from US$98 billion to US$223 billion from 2025 to 2033, representing a compound annual growth rate ("CAGR") of 11 per cent. (Satellite Communication Market Size & Share Report, 2033). Within this sector EnSilica has identified opportunities with satellite user terminal ASSPs (application specific standard parts) and satellite payload beamforming application specific integrated circuits ("ASICs"), as well as positioning, navigation and timing ("PNT") components. In this regard, EnSilica has already secured:

·    a US$3.8 million payload ASIC contract with a leading European satellite provider;

·    a user terminal ASSP design contract with a leading European satellite provider with potential future supply revenue in excess of US$50 million; and

·    US$30 million in lead customer and space agency funding to progress SatCom projects.

The opportunity is building and the Company currently has four satellite chips sampling with customers and three engagements with major operators for satellite user terminal ASSPs.

Outside of the space sector, the Board recognises a significant and rapidly growing opportunity in photonics. Photonic integrated circuits ("PICs") transmit data using light rather than electrons, enabling substantially higher bandwidth, lower power consumption and reduced heat generation compared with conventional copper electronic interconnects. These advantages are increasingly important in addressing the escalating cost, power and cooling challenges of AI (artificial intelligence) data centres. 

The global PICs market is forecast to grow from approximately US$15 - US$20 billion today to between US$86 - US$96 billion by 2034/2035, representing a CAGR of around 20 per cent. (Fortune Business Insights, May 2026).

In 2024, the Company secured a data-centre photonics controller ASIC development programme with Oriole Networks Ltd ("Oriole"). Oriole has publicly announced a collaboration with Advanced Micro Devices, Inc. ("AMD") to develop photonic networking technology for AI infrastructure. The Company believes that this programme demonstrates the potential scale of the emerging photonic networking market and the opportunity for electronic control ASICs within future AI infrastructure. 

The Fundraising will provide the Company with the requisite capital base to invest in these growth opportunities while being better placed to respond to new opportunities that may arise to enhance future growth prospects. 

Fundraising summary 

·    The Fundraising will raise gross proceeds of up to £15 million through the proposed issue of up to 16,483,516 new ordinary shares of 0.1 pence each in the share capital of the Company ("Ordinary Shares") at 91 pence per new Ordinary Share (the "Issue Price"), and will be undertaken through:

(i)         a placing of up to 15,381,315 new Ordinary Shares ("Placing Shares") to new and existing institutional investors ("Placees") at the Issue Price to raise up to £14 million (the "Placing");

(ii)        an anticipated direct subscription of 3,300 new Ordinary Shares ("Subscription Shares") at the Issue Price to raise approximately £3k (the "Subscription"); and

(iii)       a retail offer to new UK retail investors and existing shareholders of up to 1,098,901 new Ordinary Shares ("Retail Offer Shares") at the Issue Price to raise up to £1 million (the "Retail Offer").

·    The net proceeds of the Fundraising will be used to:

o  Accelerate the SatCom ASSPs development roadmap;

o  Increase satellite payload as well as PNT engineering capacity in-house;

o  Expand photonics customer opportunities through additional engineering capacity;

o  Secure dedicated manufacturing working capital to scale chip supply; and

o  Provide additional balance sheet flexibility to address potential additional SatCom, satellite payload and photonic wins and other opportunities, as well as for general working capital.

·    The Placing is being made available to certain institutional investors but is not available to the public and will be conducted by way of an accelerated bookbuild ("Bookbuild") which will open immediately following release of this Announcement in accordance with the terms and conditions set out in Appendix I.

·    Allenby Capital Limited ("Allenby Capital") and Panmure Liberum Limited ("Panmure Liberum") are acting as joint bookrunners and joint brokers in respect of the Placing (together, the "Bookrunners"). 

·    The final number and allocation of the Placing Shares will be determined by the Bookrunners in consultation with the Company and the result of the Placing and the Subscription will be announced as soon as practicable after the closing of the Bookbuild. 

·    The Retail Offer is expected to be launched shortly after the announcement of the completion of the Bookbuild.

·    Due to limits on the existing share authorities available to issue new Ordinary Shares, the Fundraising will be conducted in two tranches, as follows:

i)    a firm placing of up to 11,787,723 Placing Shares (the "First Tranche Placing Shares") at the Issue Price to be issued pursuant to the Company's existing authorities to issue and allot equity securities on a non-pre-emptive basis, granted at the general meeting of the Company on 7 April 2026 (the "First Tranche Placing"); and

ii)   conditional on the passing of the Resolutions at the General Meeting (as described further below), a further placing of up to 3,593,592 Placing Shares (the "Second Tranche Placing Shares") (the "Second TranchePlacing"), the Subscription and the Retail Offer at the Issue Price. 

Retail Offer

In addition to the Placing and the Subscription, the Company announces that there will be a separate conditional Retail Offer to new UK retail investors and existing shareholders of the Company via the BookBuild Platform to raise up to £1 million (before expenses) at the Issue Price. This is to provide new UK retail investors and existing shareholders of the Company an opportunity to participate in the Fundraising. 

Those investors who subscribe for Retail Offer Shares will do so pursuant to the terms and conditions of the Retail Offer contained in a separate announcement to be released by the Company following the close of the Bookbuild.

The Retail Offer Shares will form part of the second tranche of the Fundraising, and therefore their issue will be conditional, inter alia, upon the passing of the Resolutions at the General Meeting (as described further below) and will complete at the same time as the Second Tranche Placing.   

The Retail Offer is subject to a minimum subscription of £100 per investor and will be open to new retail investors and existing shareholders of the Company within the United Kingdom via certain intermediaries registered with the BookBuild Platform. 

The Retail Offer will be conditional on completion of the Placing and Subscription. Neither the Placing nor the Subscription is conditional upon any level of acceptance under the Retail Offer and nor is the Retail Offer underwritten. 

A separate announcement will be made by the Company regarding the Retail Offer, including its terms and timetable, following the close of the Bookbuild. 

Further details of the Fundraising and the background to and rationale for it are set out further below. 

The terms and conditions of the Bookbuild are set out in Appendix I at the end of this Announcement. 

For further information please contact:

EnSilica plc Ian Lankshear, Chief Executive Officer Kristoff Rademan, Chief Financial Officer www.ensilica.com	via Novella Communications +44 (0)20 3151 7008
Allenby Capital Limited (Nominated Adviser, Joint Broker & Joint Bookrunner) Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking) Jeremy Porter / Vivek Bhardwaj (Corporate Finance)	+44 (0)20 3002 2073 info@allenbycapital.com
Panmure Liberum Limited (Joint Broker & Joint Bookrunner) Edward Mansfield / Will King / Zak Wadud (Corporate Finance) Rupert Dearden / Rauf Munir (Corporate Broking)	+44 (0)20 3100 2000
Novella Communications (Investor & Financial Public Relations) Tim Robertson / Oliver Norton	+44 (0)20 3151 7008   ensilica@novella-comms.com

About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, and automotive markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

LEI: 213800R6VXRU7MJTAF04 

This Announcement should be read in its entirety. Attention is drawn to the section of this Announcement headed 'Important Notices' and the terms and conditions of the Placing (representing important information for invited Placees only) in Appendix I to this Announcement. 

This Announcement is made in accordance with the Company's obligations under Article 17 of UK MAR and the person responsible for arranging for the release of this Announcement on behalf of EnSilica is Ian Lankshear, Chief Executive Officer.

FURTHER DETAILS OF AND REASONS FOR THE FUNDRAISING

Further background to the Fundraising and details of the use of proceeds

Since the £10.0 million equity fundraising announced by the Company on 12 March 2026, EnSilica has made strategicprogress across each of the key objectives outlined at that time, as summarised below: 

(i)         Progress user-terminal ASSP chips to accelerate potential supply revenues: Taking advantage of the significant momentum seen in the satellite communications sector, the Company has committed investment in its critical satellite communications components to production readiness and in-turn unlocked commercial engagements. For example, on 23 April 2026, the Company announced that it had entered two landmark development contracts with a leading European satellite operator, covering a user terminal contract potentially worth in excess of US$50 million as well as a US$3.8 million satellite payload contract (the"SpaceTech Contracts"). The SpaceTech Contracts include a combination of ASIC and ASSP solutions. Every ASIC and ASSP design adds to EnSilica's IP pool, with the benefit of ASSPs (a chip built around a specific function or market) being readily available to multiple customers.

(ii)        Scale semiconductor supply revenues in growth sector: As announced on 11 June 2026, the Company completed the production tape-out of an Edge-AI chip for a customer operating in the AI sector. This milestone released a US$5 million non-recurring engineering ("NRE") and tape-out fee, to be recognised across FY2026 and FY2027, and positions the programme to enter the production phase and associated semiconductor supply revenues, which are estimated to be up to US$50 million over five years.

(iii)       Strengthen EnSilica's position in the automotive semiconductor market: With a strengthened balance sheet, the Company was able to successfully position itself in a competitive tender process to secure a seven-year manufacturing and supply contract for an Arm-based sensing chip with a German manufacturer of automotive components. As announced on 1 June 2026, this manufacturing and supply contract is expected to generate approximately US$75 million in revenue over the contract period, with the associated wafer volumes also expected to strengthen the Company's strategic relationships with its semiconductor manufacturing partners.

In addition to the above progress, the Company's year-end trading update, announced on 23 June 2026, demonstrates continued momentum in the business. In this regard, expected lifetime supply revenues currently stand at US$375 million (US$250 million at the end of February 2026) and the new business sales pipeline stands at US$600 million (even after US$125 million of contract wins transferred from the pipeline into supply revenues).  EnSilica currently has 5 chips in the supply phase and 14 chips in the design phase (with future supply expected) and is targeting 3 to 4 new design and supply contracts annually.

While these sales and revenue opportunities are positive, the Board is mindful of the capital requirements associated with taking on new opportunities in light of the Company's existing contracted commitments. Accordingly, the Board has proposed the Fundraising to exploit these opportunities, and specifically to enable the Company to:

(i)         Accelerate the SatCom ASSP development roadmap (up to £5m): The Board recognises that SatCom user terminals represent a substantial market opportunity. In particular, the global SatCom market is due to grow from US$98 billion to US$223 billion from 2025 to 2033, representing a CAGR of 11 per cent. and the service addressable market is expected to scale approximately five times by 2030. The Fundraising will enable EnSilica to accelerate the development of three critical SatCom user terminal components: distributed digital beamformer, Ka-band RF integrated circuits, and 5G NTN (non-terrestrial network) modem chips. Development of these components has been validated by the landmark SpaceTech Contracts and is expected to unlock additional matched funding from the Company's existing UK Space Agency award.

(ii)        Increase satellite payload as well as PNT engineering capacity in-house (up to £3.5m): Recruiting additional specialist workforce capacity will reduce EnSilica's reliance on outsourced services and help position EnSilica to secure follow-on phases connected to the existing US$3.8 million satellite payload contract from the SpaceTech Contracts. Additional specialist workforce capacity will also address resourcing capacity constraints associated with two further satellite payload engagements which are currently at a funded-study phase. Completion of the funded-study phase of the two satellite payload engagements will also enable EnSilica to potentially accelerate the conversion of these engagements into revenue generating contracts.

(iii)       Expand photonics customer opportunities through additional engineering capacity (up to £2.0m): Photonics is a key growth area for EnSilica, with the Company's expertise anchored by its ongoing data centre photonics controller ASIC contract with Oriole, announced in November 2024. Securing additional engineering capacity within this sector will enable EnSilica to support growing its datacentre photonics customer base and sales pipeline and reduce outsourcing dependency. For example, the Company is in active discussions in relation to AI-based (artificial intelligence) data-centre photonics controllers. EnSilica also sees further potential interest in associated quantum computing applications.

(iv)       Secure dedicated manufacturing working capital to scale chip supply (up to £3.0m): EnSilica has a demonstrated ability to scale chip supply volumes, having achieved a major shipment milestone of over ten million ASICs delivered for use in a premium automotive manufacturer's vehicles in 2025. As contracted supply revenues scale, including in respect of the US$75 million German automotive supply contract, EnSilica's demand for key inventory items increases. The Fundraising will enable EnSilica to allocate additional funding to inventory, wafer, foundry and OSAT (outsourced semiconductor assembly and test) commitments, in-turn releasing capital for new leads.

(v)        Strengthened balance sheet (up to £1.5m): Provide additional balance sheet flexibility to address potential additional SatCom, satellite payload and photonic wins and other opportunities, as well as for general working capital.

The indicated allocations of the use of proceeds are based on the maximum amount being raised under the Fundraising. In the event that a lesser amount is raised pursuant to the Bookbuild, or the Resolutions are not passed at the General Meeting and the Second Tranche Placing, Subscription and Retail Offer do not proceed, the allocations will be adjusted on a pro rata basis accordingly.

Further details of the Placing and the Subscription 

It is expected that the Placing will result in the issue of up to 15,381,315 new Ordinary Shares and the Subscription will result in the issue of 3,300 new Ordinary Shares, in each case at the Issue Price. Together the Placing and the Subscription are expected to raise up to £14 million before expenses for the Company. The Placing Shares and the Subscription Shares would, in aggregate, represent up to 11.54 per cent. of the Company's enlarged issued ordinary share capital, assuming no Retail Offer Shares are issued. The Placing will be completed in two tranches, with the Second Tranche Placing conditional on the passing of the Resolutions.

The Issue Price represents a discount of approximately 3.19 per cent. to the closing middle market price of 94 pence per Ordinary Share on 3 July 2026, being the latest practicable mid-market closing price prior to this Announcement.

Pursuant to a placing agreement dated 6 July 2026 between Allenby Capital, Panmure Liberum and the Company (the "Placing Agreement"), Allenby Capital and Panmure Liberum have conditionally agreed, as agents on behalf of the Company, severally to use their respective reasonable endeavours to procure subscribers for the Placing Shares. Allenby Capital and Panmure Liberum are not acting in relation to the Subscription.

The Placing is subject to the terms and conditions set out in Appendix I to this Announcement. The Bookrunners will commence the Bookbuild in respect of the Placing immediately following the release of this Announcement. The exact number of Placing Shares will be determined at the close of the Bookbuild and will be announced as soon as practicable thereafter. 

The timing of the closing of the Bookbuild, the number of new Ordinary Shares to be issued pursuant to the Placing and allocations among subscribers are at the absolute discretion of the Bookrunners, in consultation with the Company.  A further announcement confirming the final details of the Placing and the Subscription will be made following the closing of the Bookbuild. The Bookrunners reserve the right to close the Bookbuild without further notice. The Placing is being undertaken on a reasonable endeavours basis and is not being underwritten. Furthermore, the proposed issue of the new Ordinary Shares pursuant to the Placing and the Subscription will take place on a non-pre-emptive basis. The Second Tranche Placing and the Subscription are therefore conditional, inter alia, on the approval of the Resolutions by Shareholders at the General Meeting (as described further below).

The new Ordinary Shares, when issued, will be credited as fully paid and will rank pari passu in all respects with each other and with the existing Ordinary Shares including, without limitation, the right to receive all dividends and other distributions declared, made or paid on or after the date of issue. 

Director participation 

Kristoff Rademan, EnSilica's Chief Financial Officer, has indicated his intention to subscribe for 3,300 new Ordinary Shares at the Issue Price pursuant to the Subscription.

General Meeting

The Second Tranche Placing, the Subscription and the Retail Offer are conditional upon, amongst other things, the shareholders of EnSilica ("Shareholders") approving the passing of certain resolutions (the "Resolutions"), to be put to shareholders at a general meeting of the Company expected to be held on or around 27 July 2026 (the "General Meeting"). Such Resolutions will, if passed, grant to the Directors the authority to allot the Second Tranche Placing Shares, the Subscription Shares and the Retail Offer Shares for cash on a non-pre-emptive basis. 

The General Meeting is proposed to be held at the offices of Fieldfisher LLP at Riverbank House, 2 Swan Lane, London, EC4R 3TT at 10.00 a.m. on or around 27 July 2026, and the Company intends to publish and send a circular, which will include a notice convening the General Meeting, to Shareholders as soon as practicable following the closing of the Retail Offer next week (the "Circular"). A further announcement will be made in due course when the Circular is posted.

The First Tranche Placing is conditional upon, amongst other things, the Placing Agreement not having been terminated in accordance with its terms and First Admission (as described below) becoming effective.

The First Tranche Placing is not conditional on the passing of the Resolutions or the completion of the Second Tranche Placing, the Subscription or the Retail Offer. Should the Resolutions not be passed at the General Meeting, the Second Tranche Placing, the Subscription and the Retail Offer will not proceed. The First Tranche Placing will not be affected by any or all of the Second Tranche Placing, the Subscription and the Retail Offer failing to complete for any reason. However, the Second Tranche Placing, the Subscription and the Retail Offer are conditional upon the First Tranche Placing having completed.

Admission to AIM

Application will be made to the London Stock Exchange plc for admission of the First Tranche Placing Shares to trading on AIM, subject to completion of the Bookbuild ("First Admission"). Subject to completion of the Bookbuild, First Admission is expected to occur on or around 10 July 2026 or such later time and/or date as the Bookrunners and the Company may agree (being in any event no later than 8.00 a.m. on 24 July 2026).

Application will be made to the London Stock Exchange plc for admission of the Second Tranche Placing Shares, the Subscription Shares and the Retail Offer Shares to trading on AIM, subject to, inter alia, completion of the First Tranche Placing and the passing of the Resolutions at the General Meeting.

The times and dates set out throughout this Announcement may be adjusted by the Company in which event the Company will make an appropriate announcement to a Regulatory Information Service giving details of any revised times and dates which will also be notified to the London Stock Exchange and, where appropriate, shareholders of the Company. Shareholders of the Company may not receive any further written communication.

References to times in this Announcement are to the time in London, UK unless otherwise stated.

IMPORTANT NOTICES

Notice to Distributors

This Announcement is not for publication or distribution, directly or indirectly, in or into the United States of America. This Announcement is not an offer of securities for sale into the United States.  The securities referred to herein have not been and will not be registered under the U.S. Securities Act of 1933, as amended, and may not be offered or sold in the United States, except pursuant to an applicable exemption from registration.  No public offering of securities is being made in the United States.

UK Product Governance Requirements

Solely for the purposes of the product governance requirements contained within chapter 3 of the FCA Handbook Product Intervention and Product Governance Sourcebook (the "UK Product Governance Requirements") and disclaiming all and any liability, whether arising in tort, contract or otherwise, which any "manufacturer" (for the purposes of the UK Product Governance Requirements) may otherwise have with respect thereto, the Placing Shares have been subject to a product approval process, which has determined that the Placing Shares are: (i) compatible with an end target market of retail investors and investors who meet the criteria of professional clients and eligible counterparties, each as defined in chapter 3 of the FCA Handbook Conduct of Business Sourcebook ("COBS"); and (ii) eligible for distribution through all permitted distribution channels (the "UK Target Market Assessment"). Notwithstanding the UK Target Market Assessment, distributors should note that: the price of the Placing Shares may decline and investors could lose all or part of their investment; the Placing Shares offer no guaranteed income and no capital protection; and an investment in Placing Shares is compatible only with investors who do not need a guaranteed income or capital protection, who (either alone or in conjunction with an appropriate financial or other adviser) are capable of evaluating the merits and risks of such an investment and who have sufficient resources to be able to bear any losses that may result therefrom. The UK Target Market Assessment is without prejudice to the requirements of any contractual, legal or regulatory selling restrictions in relation to the Placing. Furthermore, it is noted that, notwithstanding the UK Target Market Assessment, the Bookrunners will only procure investors who meet the criteria of professional clients and eligible counterparties. 

For the avoidance of doubt, the UK Target Market Assessment does not constitute: (a) an assessment of suitability or appropriateness for the purposes of chapters 9A or 10A respectively of the COBS; or (b) a recommendation to any investor or group of investors to invest in, or purchase, or take any other action whatsoever with respect to Placing Shares. Each distributor is responsible for undertaking its own target market assessment in respect of the shares and determining appropriate distribution channels.

EU Product Governance Requirements 

Solely for the purposes of the product governance requirements contained within: (a) EU Directive 2014/65/EU on markets in financial instruments, as amended and as this is applied in the United Kingdom ("MiFID II"); (b) Articles 9 and 10 of Commission Delegated Directive (EU) 2017/593 supplementing MiFID II and Regulation (EU) No 600/2014 of the European Parliament, as they form part of UK law by virtue of the European Union (Withdrawal) Act 2018, as amended; and (c) local implementing measures (together, the "MiFID II Product Governance Requirements"), and disclaiming all and any liability, whether arising in tort, contract or otherwise, which any "manufacturer" (for the purposes of the MiFID II Product Governance Requirements) may otherwise have with respect thereto, the Ordinary Shares have been subject to a product approval process, which has determined that such securities are: (i) compatible with an end target market of retail investors who do not need a guaranteed income or capital protection and investors who meet the criteria of professional clients and eligible counterparties, each as defined in MiFID II; and (ii) eligible for distribution through all distribution channels as are permitted by MiFID II (the "Target Market Assessment"). The Ordinary Shares are not appropriate for a target market of investors whose objectives include no capital loss.  Notwithstanding the Target Market Assessment, distributors should note that: the price of the Ordinary Shares may decline and investors could lose all or part of their investment; the Ordinary Shares offer no guaranteed income and no capital protection; and an investment in the Ordinary Shares is compatible only with investors who do not need a guaranteed income or capital projection, who (either alone or in conjunction with an appropriate financial or other adviser) are capable of evaluating the merits and risks of such an investment and who have sufficient resources to be able to bear any losses that may result therefrom. The Target Market Assessment is without prejudice to the requirements of any contractual, legal or regulatory selling restrictions in relation to the Placing. Furthermore, it is noted that, notwithstanding the Target Market Assessment, Allenby Capital and Panmure Liberum will only procure investors who meet the criteria of professional clients and eligible counterparties. For the avoidance of doubt, the Target Market Assessment does not constitute: (a) an assessment of suitability or appropriateness for the purposes of MiFID II; or (b) a recommendation to any investor or group of investors to invest in, or purchase, or take any other action whatsoever with respect to the Ordinary Shares. Each distributor is responsible for undertaking its own target market assessment in respect of the shares and determining appropriate distribution channels.

Forward Looking Statements

This Announcement includes statements that are, or may be deemed to be, "forward-looking statements". These forward-looking statements can be identified by the use of forward-looking terminology, including the terms "believes", "estimates", "plans", "anticipates", "targets", "aims", "continues", "expects", "intends", "hopes", "may", "will", "would", "could" or "should" or, in each case, their negative or other variations or comparable terminology. These forward-looking statements include matters that are not facts. They appear in a number of places throughout this Announcement and include statements regarding the Directors' beliefs or current expectations. By their nature, forward-looking statements involve risk and uncertainty because they relate to future events and circumstances. Investors should not place undue reliance on forward-looking statements, which speak only as of the date of this Announcement.

Notice to overseas persons

This Announcement does not constitute, or form part of, a prospectus relating to the Company, nor does it constitute or contain any invitation or offer to any person, or any public offer, to subscribe for, purchase or otherwise acquire any shares in the Company or advise persons to do so in any jurisdiction, nor shall it, or any part of it form the basis of or be relied on in connection with any contract or as an inducement to enter into any contract or commitment with the Company. 

This Announcement is not for release, publication or distribution, in whole or in part, directly or indirectly, in or into the United States, Australia, Canada, Japan or the Republic of South Africa or any jurisdiction into which the publication or distribution would be unlawful. This Announcement is for information purposes only and does not constitute an offer to sell or issue or the solicitation of an offer to buy or acquire shares in the capital of the Company in  the United States, Australia, Canada, Japan,  the Republic of South Africa or any jurisdiction in which such offer or solicitation would be unlawful or require preparation of any prospectus or other offer documentation or would be unlawful prior to registration, exemption from registration or qualification under the securities laws of any such jurisdiction.  Persons into whose possession this Announcement comes are required by the Company to inform themselves about, and to observe, such restrictions.

General

Neither the content of the Company's website (or any other website) nor the content of any website accessible from hyperlinks on the Company's website (or any other website) or any previous Announcement made by the Company is incorporated into, or forms part of, this announcement.

This Announcement has been issued by, and is the sole responsibility of, the Company. 

Allenby Capital, which is authorised and regulated by the FCA in the United Kingdom, is acting as Nominated Adviser, Joint Broker and Joint Bookrunner to the Company in connection with the Placing. Allenby Capital will not be responsible to any person other than the Company for providing the protections afforded to clients of Allenby Capital or for providing advice to any other person in connection with the Placing or any acquisition of shares in the Company. Allenby Capital has not authorised the contents of, or any part of, this announcement, no representation or warranty, express or implied, is made by Allenby Capital in respect of such contents, and no liability whatsoever is accepted by Allenby Capital for the accuracy of any information or opinions contained in this Announcement or for the omission of any material information, save that nothing shall limit the liability of Allenby Capital for its own fraud. Allenby Capital's responsibilities as the Company's nominated adviser under the AIM Rules for Nominated Advisers are owed solely to the London Stock Exchange and are not owed to the Company or to any Director or to any other person.

Panmure Liberum, which is authorised and regulated by the FCA in the United Kingdom, is acting as Joint Bookrunner and Joint Broker to the Company in connection with the Placing. Panmure Liberum will not be responsible to any person other than the Company for providing the protections afforded to clients of Panmure Liberum or for providing advice to any other person in connection with the Placing or any acquisition of shares in the Company. Panmure Liberum is not making any representation or warranty, express or implied, as to the contents of this Announcement. Panmure Liberum has not authorised the contents of, or any part of, this Announcement, and no liability whatsoever is accepted by Panmure Liberum for the accuracy of any information, or opinions contained in this Announcement or for the omission of any material information,save that nothing shall limit the liability of Panmure Liberum for its own fraud.

No statement in this Announcement is intended to be a profit forecast and no statement in this Announcement should be interpreted to mean that the earnings per share of the Company for the current or future financial years would necessarily match or exceed the historical published earnings per share of the Company.

This Announcement does not constitute a recommendation concerning any investor's investment decision with respect to the Placing, the Subscription or the Retail Offer. Each investor or prospective investor should conduct his, her or its own investigation, analysis and evaluation of the business and data described in this Announcement and publicly available information.

The new Ordinary Shares will not be admitted to trading on any stock exchange other than the AIM market of the London Stock Exchange.

Appendix I to this Announcement sets out the terms and conditions of the Placing. By participating in the Bookbuild, each person who is invited to and who chooses to participate in the Placing by making or accepting an oral and/or written legally binding offer to subscribe for Placing Shares will be deemed to have read and understood this Announcement (including Appendix I) in its entirety, to be making or accepting such offer on the terms and subject to the conditions of the Placing set out in this Announcement and to be providing the representations, warranties, undertakings, agreements and acknowledgements contained in Appendix I.

The price and value of securities can go down as well as up. Past performance is not a guide to future performance.

Read the full RNS announcement…

https://www.londonstockexchange.com/news-article/ENSI/proposed-equity-fundraising-via-abb/17674512

Vertical Aerospace, whose Valo aircraft is expected to enter service from 2030, said it was in high-level discussions about potential orders from the Ministry of Defence (MoD) and the Pentagon.

Stuart Simpson, the start-up's chief executive, said the Valo was well-suited to fulfilling logistics requirements on the battlefield. It could also be weaponised for a combat role or used for transferring personnel between Royal Navy vessels.

Discussions with a number of Western militaries concern a hybrid version of the electric vertical takeoff and landing (eVOL) craft, which would use a small gas turbine to recharge its batteries.

Mr Simpson said the hybrid aircraft would still be able to land in near silence, while doubling its potential payload to more than a ton.

‘He said: "We are having discussions right at the top of the house with the military. We've got some fantastic connections both here and across the pond. We talk to all the forces at a very senior level.

"For battlefield logistics, you can take off silently, cruise in near silence and then land in silence. At cruising altitude, the gas turbine is so small you can barely hear it."

The aircraft could also be flown autonomously, without a pilot, Mr Simpson said.

The Valo's battery packs could be used to power electrical equipment on the front line as an alternative to diesel generators.

Vertical Aerospace claims the rival eVTOLs being developed by California-based Joby and Archer are less suited to a battlefield environment, arguing they are too small to be refitted with hybrid engines.’

Read the full article…

https://www.yahoo.com/news/world/articles/ministry-defence-plots-flying-taxis-090000383.html

New flexible, low-carbon NFC chip delivers instant tamper detection, product authentication and deeper brand engagement to protect consumers, secure supply chains and build lasting trust.

• Early access program launches for customers to source Pragmatic NFC Protect PR1311 from key assembly partners
• Tamper detection for retail, healthcare and industrial applications to deter counterfeiting and grey market activity across the product lifecycle with the simple tap of a smartphone
• Unique digital product identity and digital tamper evidence enables trusted verification of product authenticity and tamper status for consumers, retailers and brands
• Cost-optimised, sustainable item-level intelligence at scale for mass market adoption

CAMBRIDGE, United Kingdom, 23rd June 2026: Pragmatic Semiconductor, a pioneer in flexible semiconductor technology, today announced the launch of its new tamper detection product, Pragmatic NFC Protect PR1311. Designed to help brands protect customers, safeguard product integrity, and strengthen reputation and trust, NFC Protect provides a simple way for consumers to verify that a product is intact, genuine and safe at every stage of its lifecycle. Flexible and imperceptible to the touch, the new chip integrates seamlessly into products and packaging, including on curved surfaces, enabling brands to build trust while preserving aesthetics and maintaining consumer experience.

Counterfeiting, tampering, and grey market diversion erode consumer confidence and brand reputation, and most critically, expose customers to potential harm. Sectors where product integrity is directly linked to consumer safety are most vulnerable to these growing problems, including wine and spirits, pharmaceutical and wellness products, beauty and cosmetics, industrial products, baby foods and pet food. NFC Protect provides integrated sensing to detect tamper incidents, enabling consumers and brands to instantly verify a product’s status and seal integrity with just a tap of a smartphone.

Key benefits: 

• Product safeguarding: provides clear, accessible proof of product integrity throughout the customer journey, helping reduce risk for consumers, retailers and brands while increasing transparency and trust across the supply chain.
• Brand protection: creates a persistent product identity through a unique serial number programmed and locked at manufacture combined with real-time tamper status to enhance traceability through the product lifecycle.
• Consumer experience: extends value beyond first-use verification by enabling ongoing, contextual consumer interactions tailored to the product’s tamper status, delivering a richer, long-term brand engagement.
• Sustainable intelligence: manufactured using advanced low-carbon production technique, NFC Protect combines sustainability, cost efficiency, and mass market scalability to enable brands to rapidly deploy protection across more products and markets.

James Davey, SVP Sales, Business Development and Product Management at Pragmatic Semiconductor, said, “The value of global trade in counterfeit goods is estimated at almost half a trillion dollars annually1, with the growth of e-commerce creating new opportunities for product tampering and fraud. Pragmatic NFC Protect PR1311 enables brands to invisibly embed authentication and data integrity throughout the product lifecycle, from production to consumption. Our partners can now expand their product portfolios to provide customers with secure digital proof of a product’s status, giving people control and confidence wherever and however they choose to purchase.”

Avery Dennison is a global leader in materials science and digital identification solutions. It is also a strategic investor in Pragmatic. Mathieu De Backer, the company’s VP of Intelligent Labels Innovation, added, “The future of connected products depends on more than proving authenticity – confidence and integrity are required throughout each stage of the supply chain. NFC Protect has the potential to unlock a new generation of trusted, intelligent packaging and products. As a long-term strategic partner of Pragmatic Semiconductor, we’re excited to explore how this pioneering innovation can make item-level tamper detection accessible at true mass market scale.”

Frank Lehmann, Vice President of Corporate Venturing and Open Innovation at Amcor, a global leader in packaging solutions for consumer and healthcare products and a strategic investor in Pragmatic Semiconductor, said, “Consumers need to trust that the products they purchase have not been opened or compromised before use. By making tamper detection practical at scale, this innovation could help brands strengthen trust while unlocking new opportunities for protected packaging, particularly in high-risk industries like beauty, wellness and healthcare industries.”

Qiao Luyun, Chairman at Jinjia Group, said, “Smart packaging has emerged as a critical touchpoint for brands to foster consumer trust. By enabling seamless consumer interaction via NFC tags, brands can deepen connections with audiences and boost brand awareness. This solution also captures user behavioural data and consumer feedback to power targeted marketing campaigns, expand service portfolios and refine pricing strategies. Integrating tamper detection, product authentication and digital interactive capabilities into conventional packaging marks an inspiring milestone for the whole industry.”

Sebastian Münscher, Senior Product Manager RFID/NFC Solutions, Schreiner MediPharm, said, “Brands are increasingly looking at packaging as a strategic opportunity for consumer engagement and brand protection. Pragmatic’s latest tamper detection technology has the potential to make product integrity solutions commercially viable at a scale that opens entirely new opportunities for both brand owners and consumers. As a leading supplier of RFID and NFC labels to the pharmaceutical industry, we see a great potential to include Pragmatic’s new tamper detection technology in our solutions for digital first-opening indication such as our Cap-Lock Labels for syringes and vials, or our Autoinjector-Labels.

Lesley Suen, VP Product and Tech, IT & GM GC, SML, said, “We see strong potential in exploring how Pragmatic’s flexible semiconductor technology could complement SML’s expertise in digital identity and connected products. Through this collaboration, we look forward to exploring opportunities to work together across product authentication, consumer engagement, and supply chain transparency, while gaining deeper insights into how these technologies may help address evolving industry needs.”

• Astronics to supply low-voltage power distribution system for Vertical's Valo aircraft
• Supplier agreement strengthens Vertical's world-class aerospace supplier ecosystem as the Company advances toward certification and scaled production

LONDON & EAST AURORA, N.Y.--(BUSINESS WIRE)--Vertical Aerospace ("Vertical" or the "Company") (NYSE: EVTL), a global aerospace and technology company that is pioneering electric aviation, today announced a long-term agreement with Astronics Corporation (NASDAQ: ATRO), a leading provider of advanced technologies for the global aerospace, defense and other mission critical industries, to supply the low-voltage ("LV") power distribution system for Vertical's Valo electric vertical take-off and landing (eVTOL) aircraft.

Under the agreement, Astronics will provide the aircraft's LV power distribution system, including power conversion and distribution hardware that manages and protects electrical power for critical aircraft systems. The system converts high-voltage electrical power from the aircraft's propulsion architecture into low-voltage power used by avionics, flight controls and other essential onboard systems.

Astronics has supported Vertical throughout the prototype phase of aircraft development, with its hardware already integrated into Vertical's piloted flight test aircraft. The company's purpose-built eVTOL electrical power solutions and extensive aerospace experience make it the ideal supplier for Valo as Vertical advances toward certification and commercial production.

This agreement further strengthens Vertical's supplier ecosystem across Valo’s key aircraft systems, including leading suppliers such as Honeywell (flight control and aircraft management systems), Aciturri (airframe structures), Evolito (electric propulsion units), Hyundai WIA (landing gear), Syensqo (composite materials) and Isoclima (transparencies).

Stuart Simpson, CEO of Vertical Aerospace, said:

"Building a certifiable aircraft requires not only breakthrough technology, but also a world-class supplier ecosystem. Astronics brings deep expertise in aircraft electrical power systems and has already demonstrated its capabilities through our flight test programme. This agreement is another important step as we mature Valo's design, strengthen our supply chain and advance toward certification and commercial production."

Jon Neal, President of Astronics Advanced Electronic Systems, said:

"Astronics is proud to be working with Vertical Aerospace as the supplier of their power distribution system for the Valo aircraft. Our CorePower® system is purpose-built for eVTOL applications, combining high-voltage power conversion with low-voltage power distribution delivering reliable, fault-protected power to flight-critical systems including avionics, flight controls, and navigation. CorePower was designed from the ground up to meet aerospace certification standards, giving our customers a lightweight, compact solution that reduces integration risk and supports their path to type certification. We look forward to continuing our close collaboration with the Vertical team through CDR and Valo's entry into service.”

The announcement follows continued progress on the Valo programme as Vertical advances toward Critical Design Review (CDR), establishing the certifiable design baseline for the aircraft ahead of certification-conforming aircraft production and testing.

About Astronics Corporation

Astronics Corporation (Nasdaq: ATRO) serves the world’s aerospace, defense, and other mission critical industries with proven, innovative technology solutions. Astronics works side-by-side with customers, integrating its array of power, connectivity, lighting, structures, interiors, and test technologies to solve complex challenges. For over 50 years, Astronics has delivered creative, customer-focused solutions with exceptional responsiveness. Today, global airframe manufacturers, airlines, militaries, completion centers and Fortune 500 companies rely on the collaborative spirit and innovation of Astronics. The Company’s strategy is to increase its value by developing technologies and capabilities that provide innovative solutions to its targeted markets. For more information on Astronics and its solutions, visit Astronics.com.

About Vertical Aerospace

Vertical Aerospace is a global aerospace and technology company pioneering electric aviation. Vertical is creating a safer, cleaner, and quieter way to travel. Valo is a piloted, four-passenger, Electric Vertical Take-Off and Landing (eVTOL) aircraft, with zero operating emissions. Vertical is also developing a hybrid-electric variant, offering increased range and mission flexibility to meet the evolving needs of the advanced air mobility market.

Vertical combines partnerships with leading aerospace companies, including Honeywell, Syensqo and Aciturri, with its own proprietary battery and propeller technology to develop the world's most advanced and safest eVTOL.

Vertical has c.1,500 pre-orders of Valo, with customers across four continents, including American Airlines, Avolon, Bristow, GOL and Japan Airlines. Certain customer obligations are expected to be fulfilled via third-party agreements. Headquartered in Bristol, UK, Vertical's experienced leadership team comes from top-tier aerospace and automotive companies such as Rolls-Royce, Airbus, GM, and Leonardo. Together, they have previously certified and supported over 30 different civil and military aircraft and propulsion systems.

Forward-Looking Statements

This press release contains forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995 that relate to our current expectations and views of future events. We intend such forward-looking statements to be covered by the safe harbor provisions for forward-looking statements as contained in Section 27A of the Securities Act and Section 21E of the Exchange Act. Any express or implied statements contained in this press release that are not statements of historical fact may be deemed to be forward-looking statements, including, without limitation, statements regarding a long-term supply agreement with Astronics to supply the low-voltage power distribution system for Valo, the design and manufacture of our aircraft and the hybrid-electric variant, certification and the commercialization of our aircraft and our ability to achieve regulatory certification of our aircraft product on any particular timeline or at all, the features and capabilities of the aircraft, business strategy and plans and objectives of management for future operations, including the building and testing of our prototype aircrafts on timelines projected, completion of the piloted test programme phases, selection of suppliers; as well as statements that include the words “expect,” “intend,” “plan,” “believe,” “project,” “forecast,” “estimate,” “may,” “should,” “anticipate,” “will,” “aim,” “potential,” “continue,” “are likely to” and similar statements of a future or forward-looking nature. Forward-looking statements are neither promises nor guarantees, but involve known and unknown risks and uncertainties that could cause actual results to differ materially from those projected, including, without limitation, the other important factors discussed under the caption “Risk Factors” in our Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (“SEC”) on March 24, 2026, as such factors may be updated from time to time in our other filings with the SEC. Any forward-looking statements contained in this press release speak only as of the date hereof and accordingly undue reliance should not be placed on such statements. We disclaim any obligation or undertaking to update or revise any forward-looking statements contained in this press release, whether as a result of new information, future events or otherwise, other than to the extent required by applicable law.